全部產品類別

Application BGA

Height 2.4mm / 2.8mm (Test / Rest)

Pitch Range (Min.) 0.50mm

Working Spring Force 32gf@0.40mm

Temperature -40~125℃

Application BGA

Height 2.4mm / 2.8mm (Test / Rest)

Pitch Range (Min.) 0.50mm

Working Spring Force 32.0gf@0.40mm

Temperature -40~125℃

Application BGA

Height 2.4mm / 2.8mm (Test / Rest)

Pitch Range (Min.) 0.50mm

Working Spring Force 22.0gf@0.40mm

Temperature -40~125℃

Application BGA

Height 2.4mm / 2.8mm (Test / Rest)

Pitch Range (Min.) 0.50mm

Working Spring Force 22.0gf@0.40mm

Temperature -40~125℃

Application BGA

Height 2.4mm / 2.8mm (Test / Rest)

Working Spring Force 23.0gf@0.40mm

Recommended Travel 0.4mm

Temperature -45~125℃

Application BGA

Height 2.4mm / 2.8mm (Test / Rest)

Pitch Range (Min.) 0.50mm

Working Spring Force 22.0gf@0.40mm

Temperature -40~125℃

Application BGA

Height 6.47mm / 6.97mm (Test / Rest)

Pitch Range (Min.) 0.5mm

Working Spring Force 28gf@0.50mm

Recommended Travel 0.50mm

Temperature -40~125℃

Tip (device side / PCB side) Crown / Crown

Application BGA

Height 3.15mm / 3.55mm (Test / Rest)

Working Spring Force 16gf@0.4mm

Recommended Travel 0.4mm

Temperature -40~125℃

Application LGA / WLCSP

Height 3.4mm / 3.75mm (Test / Rest)

Pitch Range (Min.) 0.2mm

Working Spring Force 13.6gf@0.35mm

Recommended Travel 0.35mm

Temperature -55~125℃

Tip (device side / PCB side) Sarp Kelvin end / Cone

Clean Pad
T : 1.45~1.50 mm Size : 182*257 mm
Clean layer : 0.25~0.30 mm
substrate : 1.2 mm
MOQ : 10 SHEET

Clean Pad
T : 0.85~0.88 mm Size : 182*257 mm
Clean layer : 0.25~0.28 mm
substrate : 0.6 mm
MOQ : 10 SHEET

Clean Pad
T : 0.75~0.78 mm Size : 182*257 mm
Clean layer : 0.25~0.28 mm
substrate : 0.5 mm
MOQ : 10 SHEET