Mechanical
Application BGA
Height 1.8mm / 2.2mm (Test / Rest)
Working Spring Force 21gf@0.4mm
Recommended Travel 0.4mm
Temperature -55~150℃
Tip (device side / PCB side) Cone / Cone
Height 1.8mm / 2.2mm (Test / Rest)
Working Spring Force 21gf@0.4mm
Recommended Travel 0.4mm
Temperature -55~150℃
Tip (device side / PCB side) Cone / Cone
Electrical
Contact resistance < 50 mΩ
Current carrying capacity 2A Continuous
Insertions
Cycle life > 300K
BOM (Material VS Plating)
Plunger-top : Pd Alloy
Barrel : PBT / Au plated
Spring : SWP / Au plated
Bottom : BeCu / Au plated